Loop filter integration in phase-locked loops

ABSTRACT

A phase-locked loop and method of operation are disclosed. One embodiment includes providing a phase-locked loop, comprising a charge pump system comprising a first charge pump and a second charge pump, the charge pump system configured to provide control signals, a dual path filter, the dual path filter consisting of passive components that are configured to provide summation of control signals, wherein the dual path filter includes a first node coupled between a first charge pump and a first capacitor, wherein the dual path filter includes a second node coupled to a second charge pump through a first resistor, wherein the second node is connected to the first capacitor, and a voltage source coupled to the second node through a second resistor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention is generally related to frequency synthesizers. Moreparticularly, the invention relates to phase-locked loops that includeloop filters integrated entirely on a semiconductor chip.

2. Related Art

Frequency synthesizers are regularly employed in communicationtransceivers used in numerous types of communication systems andcommunication technologies. The frequency synthesizer typically includesa phase-locked loop comprising an oscillator, such as avoltage-controlled oscillator, a loop filter, and a phase-frequencydetector. A problem with conventional phase-locked loop designs is thatthe conventional loop filter consists of capacitors that often consumetoo much space to practically allow integration on a chip.

FIG. 1 is a block diagram that illustrates an example phase-locked loop(PLL) 160. The phase-locked loop 160 includes a phase-frequency detector(PFD) 162, a charge pump (CP) 164, a loop filter 166, avoltage-controlled oscillator (VCO) 168, and a divide-by-N (/N) module170. Note that N can be a fractional or integer value. Although shownusing a divide-by-N module 170, the phase-locked loop 160 can also beimplemented using a mixer in place of the divide-by-N module 170. Theuse of a mixer in place of the divide-by-N module 170 provides anarchitecture that is known in the industry as an “offset-phase-lockedloop” or “translational loop.” The phase-locked loop 160 locks theoutput signal of the VCO 168 to a clock signal (designated referencesignal, Vref) that is N times lower in frequency than the VCO outputsignal.

The PFD 162 controls the frequency of the output signal of the VCO 168.The PFD 162 of the phase-locked loop 160 receives the divided VCO outputsignal from the divide-by-N module 170 at one input terminal andcompares the phase and frequency of the divided VCO output signal to thereference signal, Vref, received at the other input terminal. Based onthe comparison of the divided VCO output signal to the reference signal,the PFD 162 generates control signals to the charge pump 164, whichgenerates a control signal (e.g., current signal) that is low-passfiltered by the loop filter 166 and then provided to the VCO 168. Thefiltered control signal output from the loop filter 166 is received by avaractor (not shown) in the VCO 168. The filtered control signal fromthe loop filter 166 tunes the varactor by changing the voltage acrossthe varactor, thereby changing the frequency (and the phase) of theoutput signal of the VCO 168. The output signal of the VCO 168 is thendivided down by the divide-by-N module 170 for comparison with the lowerclock frequency, Vref, at the PFD 162 to adjust to the same phase andfrequency.

The loop filter 166 generally comprises an integrating capacitor 174,with a value generally in the range of a few hundred pico-Farads for UHF(ultra-high-frequency) phase-locked loops. The integrating capacitor 174is configured in parallel with a series R-C combination (i.e., aresistor 171-capacitor 173 series arrangement), which creates alow-frequency zero in the frequency response of the loop filter 166. Alow-frequency zero can improve stability of the phase-locked loop 160.One well-known mechanism for creating a low-frequency zero is by using alarge capacitor (e.g., capacitor 173 is typically in the range of a fewnano-Farads). The integrating capacitor 174 is also in parallel withanother R-C combination (resistor 172 and capacitor 175), whichattenuates high-frequency signal components that are output from thecharge pump 164 and creates a high-frequency pole in the frequencyresponse of the loop filter 166. These resistor-capacitor networks ofthe loop filter 166 pose integration difficulties with the rest of thephase-locked loop components because of the large amount of spaceconsumed to realize the needed capacitance (e.g., in the few nano-Faradsrange).

Several attempts at integrating a loop filter onto a chip are known inthe art. One example implementation is illustrated in FIG. 2A. FIG. 2Ais a block diagram of an example phase-locked loop (PLL) 260 configuredwith what is known in the art as a dual-path loop filter 266. Thiscircuit is described in further detail in “A 1.5V 900 MHz MonolithicCMOS Fast-Switching Frequency Synthesizer For Wireless Applications,” byC. W. Lo, H. C. Luong, in the 2000 Symposium on VLSI Circuit Digest ofTechnical papers, pp. 238–241, herein incorporated by reference. Thephase-locked loop 260 includes a phase-frequency detector (PFD) 262, acharge pump (CP) system 264 comprising charge pump modules 269 a and 269b, a loop filter 266, a voltage-controlled oscillator (VCO) 268, and adivide-by-N (/N) module 270. The general principles of operation for thephase-locked loop 260 are similar to that described for the phase-lockedloop 160 of FIG. 1. However, in the example phase-locked loop 260, thecharge pump system 264 includes two modules 269 a and 269 b that providecurrent signals I_(CP1) and I_(CP2) on output connections 280 and 282,respectively. Connections 280 and 282 are a point of origination fordual paths of the loop filter 266. The current signals from each module269 a and 269 b are a ratio of each other (e.g., they both increase ordecrease based on the signals from the PFD 262). Generally, the currentvalues at connections 280 and 282 are different (e.g., 10 microamperesversus 100 microamperes, respectively). The use of dual paths carryingcurrent signals that are a ratio of each other provides a mechanism toobtain low-frequency zeroes for the frequency response of the loopfilter 266 while enabling a reduction in the size of the capacitors ofthe loop filter 266 to conserve chip area.

The loop filter 266 comprises R-C networks configured as an integrator284 in the path corresponding to connection 280, and a low-pass filter(LPF) 286 in the path corresponding to connection 282. Signals from theintegrator 284 and the LPF 286 are provided on separate connections 290and 291 to the VCO 268, which is shown in further detail in FIG. 2B.

The VCO 268 includes, among other components, back-to-back varactors 202and 204. Varactor 202 includes back-to-back, reverse-biased diodes 206and 208, and varactor 204 includes back-to-back, reverse-biased diodes210 and 212. The output of the integrator 284 (FIG. 2A) is provided overconnection 290 to node 218 corresponding to varactor 202. The output ofthe LPF 286 (FIG. 2A) is provided over connection 291 to node 220corresponding to varactor 204. Diodes 206, 208, 210, and 212 areweighted to enable summation of the outputs of the integrator 284 andLPF 286 in the capacitance domain. Typically, one varactor set will havea K_(VCO) (i.e., the control characteristic of a VCO in frequency pervoltage) that is scaled in comparison to the other set. For example,varactor 202 may have a K_(VCO) of approximately 10 mega-Hertz (MHz) pervolt, whereas the other varactor 204 may be ten times less in K_(VCO)value. Thus, the varactors 202 and 204 of the VCO 268 combine thedifferent filtering characteristics of the loop filter paths, enablingsmaller capacitance values for the loop filter 266 than those utilizedin the loop filter 166 (FIG. 1) for the phase-locked loop 160 of FIG. 1.Yet, the output signal of the phase-locked loop 260 approximates theoutput signal provided in the phase-locked loop 160.

Similar dual-path solutions have been disclosed. In J. Craninckx and M.Steyaert's article, “A Fully-Integrated CMOS DCS-1800 FrequencySynthesizer,” IEEE Journal of Solid State Circuit (JSSC), December 1998,pp. 2054–2065, herein incorporated by reference, a dual-path loop filteris used to create a low-frequency zero in the frequency response of theloop filter by adding an integrator path and a low-pass filter path.Each of these paths has a separate charge pump modules, as shown in FIG.2A. This implementation is disclosed using two active devices to do thesummation of the two paths. However, the active components can createextra noise.

Another solution is described in the 2001 Symposium on VLSI CircuitsDigest of Technical Papers, pp. 43-46, entitled, “A Fully-IntegratedCMOS Frequency Synthesizer With Charge-Averaging Charge Pump AndDual-Loop Path Filter for PCS and Cellular CDMA Wireless Systems,” by Y.Yoo, et al., herein incorporated by reference. In this implementation, aunity gain buffer is used to combine the two paths, thus using only asingle active device.

Although some of these implementations facilitate the integrationon-chip of loop filters by reducing the capacitance and consequently thearea consumed by the capacitive device, it would be desirable to providea phase-locked loop having a loop filter integrated on chip and havingreduced complexity and improved noise performance while notsignificantly altering the loop transfer characteristics.

SUMMARY

Embodiments of a phase-locked loop and method of operation aredisclosed. One embodiment includes a phase-locked loop, comprising acharge pump system comprising a first charge pump and a second chargepump, the charge pump system configured to provide control signals, adual path filter, the dual path filter consisting of passive componentsthat are configured to provide summation of the conrol signals, whereinthe dual path filter includes a first node coupled between a firstcharge pump and a first capacitor, wherein the dual path filter includesa second node coupled to a second charge pump through a first resistor,wherein the second node is connected to the first capacitor, and avoltage source coupled to the second node through a second resistor.

Related devices, systems, and methods of operation are also provided.Other systems, methods, features, and advantages of the invention willbe or become apparent to one with skill in the art upon examination ofthe following figures and detailed description.

BRIEF DESCRIPTION OF THE FIGURES

Preferred embodiments of a phase-locked loop and corresponding methodsof operation can be better understood with reference to the followingfigures. The components within the figures are not necessarily to scale,emphasis instead being placed upon clearly illustrating the principlesof operation of a phase-locked loop. Moreover, in the figures, likereference numerals designate corresponding parts throughout thedifferent views.

FIG. 1 is a block diagram illustrating one example conventionalphase-locked loop.

FIG. 2A is a block diagram illustrating a second example conventionalphase-locked loop utilizing a dual path filter.

FIG. 2B is a schematic diagram of an example conventionalvoltage-controlled oscillator as shown in FIG. 2A.

FIG. 3 is a block diagram illustrating an example implementation for aphase-locked loop according to an embodiment of the invention.

FIG. 4 is a block diagram illustrating one embodiment of thephase-locked loop of FIG. 3.

FIG. 5 is a block diagram illustrating another embodiment of thephase-locked loop of FIG. 3.

DETAILED DESCRIPTION

Preferred embodiments of a phase-locked loop comprising a loop filterthat can be integrated on-chip with other phase-locked loop componentsare disclosed. The phase-locked loop embodiments described hereinutilize a dual path arrangement that provides charge pump controlsignals that are a ratio of each other, and comprise passive components(e.g., resistor(s), capacitor(s), etc.) to do the summation of dualpaths in a loop filter, thus reducing noise problems that are oftencharacteristic of active components (e.g., operational amplifiers) usedto perform such summation functions in conventional systems. Loopfilters described herein will also be referred to as dual path filters.Further, the phase-locked loop embodiments do not need two sets ofweighted back-to-back varactors (e.g., one for the integrator path, theother for the LPF path as shown in FIG. 2B), since a weighted summationcan easily be done by the ratio of the passive components (e.g.,resistors and capacitors) of a loop filter. In one embodiment, currentthrough a resistor in a loop filter is scaled up (e.g., increased) andcurrent through a capacitor in the loop filter is scaled down (e.g.,decreased) to provide a low-frequency zero without consuming excessivechip area.

As a brief overview, an example implementation for a phase-locked loopis described in association with FIG. 3. The phase-locked loop will bedescribed in the context of a portable transceiver using adouble-downconversion receiver (e.g., downconvert from radio-frequency(RF) to intermediate frequency (IF), and then from IF to baseband), withthe understanding that transceivers using other receiver architecturessuch as direct conversion or low/zero-IF can similarly be used. Further,two embodiments of the phase-locked loop of FIG. 3 are described inassociation with FIGS. 4 and 5. Although described with particularreference to a portable transceiver, the phase-locked loop embodimentsof FIGS. 4 and 5, among other embodiments, can be implemented insubstantially any system that provides frequency control for asynthesizer or like-systems and/or devices.

FIG. 3 is a block diagram of a simplified, example portable transceiver300 that illustrates an example implementation for a phase-locked loop(PLL) 360 according to an embodiment of the invention. The portabletransceiver 300 generally includes a speaker 301, display 302, keyboard303, and microphone 304, all connected to a baseband subsystem 320. In aparticular embodiment, the portable transceiver 300 can be, for examplebut not limited to, a portable telecommunication device such as amobile/cellular-type telephone. The speaker 301 and display 302 receivesignals from the baseband subsystem 320 via connections 305 and 306,respectively, as known to those skilled in the art. Similarly, thekeyboard 303 and microphone 304 supply signals to the baseband subsystem320 via connections 307 and 308, respectively.

The baseband subsystem 320 includes a microprocessor (MP) 309, memory310, analog circuitry 311, and a digital signal processor (DSP) 312 incommunication via a bus 313. The bus 313, although shown as a singlebus, may be implemented using multiple busses connected as necessaryamong the subsystems within the baseband subsystem 320. Themicroprocessor 309 and memory 310 provide the signal timing, processingand storage functions for the portable transceiver 300. The analogcircuitry 311 provides the analog processing functions for the signalswithin the baseband subsystem 320. The baseband subsystem 320 providescontrol signals to a radio frequency (RF) subsystem 350 via connection316. Although shown as a single connection 316, the control signals mayoriginate from the DSP 312 and/or from the microprocessor 309, and aresupplied to a variety of points within the RF subsystem 350. It shouldbe noted that, for simplicity, only the basic components of the portabletransceiver 300 are illustrated herein.

The baseband subsystem 320 also includes, in one embodiment, ananalog-to-digital converter (ADC) 314 and a digital-to-analog converter(DAC) 315. The ADC 314 and DAC 315 also communicate with themicroprocessor 309, memory 310, analog circuitry 311, and the DSP 312via the bus 313. The DAC 315 converts the digital communicationinformation within the baseband subsystem 320 into an analog signal fortransmission to the RF subsystem 350 via connection 318. Connection 318,shown as two directed arrows, includes the information that is to betransmitted by the RF subsystem 350 after conversion from the digitaldomain to the analog domain.

The RF subsystem 350 includes a modulator 321 which, after receiving afrequency reference signal (also called a “local oscillator” signal or“LO”) from the synthesizer 345 via connection 328, modulates thereceived analog information and provides a modulated signal viaconnection 322 to an upconverter 323. In a constant envelope modulationmethodology, the modulated transmit signal generally includes only phaseinformation. The upconverter 323 also receives a frequency referencesignal from the synthesizer 345 via connection 327. The synthesizer 345determines the appropriate frequency to which the upconverter 323upconverts the modulated signal on connection 322.

The synthesizer 345 also includes the phase-locked loop 360 according toan embodiment of the invention. The synthesizer 345 uses thephase-locked loop 360 to precisely control the phase and frequency ofthe output signal of an oscillator (not shown), such as avoltage-controlled oscillator (VCO) disposed in the synthesizer 345.

The upconverter 323 supplies the modulated signal via connection 324 toa power amplifier 325. The power amplifier 325 amplifies the modulatedsignal on connection 324 to the appropriate power level for transmissionvia connection 326 to antenna 330. Illustratively, a switch 331 controlswhether the amplified signal on connection 326 is transferred to antenna330 or whether a received signal from antenna 330 is supplied to areceive filter 332. The operation of the switch 331 is controlled by acontrol signal from the baseband subsystem 320 via connection 316.Alternatively, the switch 331 may be replaced by a filter pair (e.g., aduplexer) that allows simultaneous passage of both transmit signals andreceive signals, as is known in the art.

A signal received by the antenna 330 will be directed to the receivefilter 332. The receive filter 332 filters the received signal andsupplies the filtered signal on connection 333 to a low-noise amplifier(LNA) 334. The receive filter 332 is a band pass filter, which passesall channels of the particular cellular system in which the portabletransceiver 300 is operating. As an example, for a 900 MHz (mega-Hertz)GSM (Global System for Mobile Communication) system, the receive filter332 would pass all frequencies from 925 MHz to 960 MHz, covering all 175contiguous channels of approximately 200 kHz (kilo-Hertz) each. Onepurpose of this filter 332 is to reject all frequencies outside thedesired region. The LNA 334 amplifies the relatively weak signal onconnection 333 to a level at which the downconverter 336 can translatethe signal from the transmitted frequency to an intermediate frequency(IF). Alternatively, the functionality of the LNA 334 and thedownconverter 336 can be accomplished using other elements, such as alow-noise block downconverter (LNB), among others.

The downconverter 336 receives a frequency reference signal (or “localoscillator” signal or “LO”) from the synthesizer 345 (e.g., via thephase-locked loop 360), via connection 329, which signal instructs thedownconverter 336 as to the proper frequency to downconvert the signalreceived from the LNA 334 via connection 335. The downconvertedfrequency is called the intermediate frequency or IF. The downconverter336 sends the downconverted signal via connection 337 to a channelfilter 338, also called an “IF filter.” The channel filter 338 filtersthe downconverted signal and supplies it via connection 339 to anamplifier 340. The channel filter 338 selects the one desired channeland rejects all others. Using the GSM system as an example, only one ofthe 175 contiguous channels is desired to be processed.

After all channels are passed by the receive filter 332 anddownconverted in frequency by the downconverter 336, only the onedesired channel will appear precisely at the center frequency of thechannel filter 338. The synthesizer 345, by controlling the localoscillator operating frequency supplied on connection 329 to thedownconverter 336, determines the selected channel. The amplifier 340amplifies the received signal and supplies the amplified signal viaconnection 341 to a demodulator 342. The demodulator 342 recovers thetransmitted analog information and supplies a signal representing thisinformation via connection 317 to the ADC 314. The ADC 314 convertsthese analog signals to a digital signal at baseband frequency andtransfers the signal via the bus 313 to the DSP 312 for furtherprocessing. Alternatively, the downconverted carrier frequency (IFfrequency) at connection 337 may be 0 Hz, in which case the receiver isreferred to as a “direct conversion receiver.” In such a case, thechannel filter 338 is implemented as a low-pass filter, and thedemodulator 342 may be omitted.

FIG. 4 illustrates a block diagram of one embodiment of the phase-lockedloop 360 shown in FIG. 3. The phase-locked loop 360 a includes aphase-frequency detector (PFD) 462, a charge pump (CP) system 464comprising charge pump modules 469 a and 469 b, a loop filter 466, acontrollable oscillator such as a voltage-controlled oscillator (VCO)468, and a mixer 472. Note that in some embodiments, a divide-by-Nmodule (where N can be a fractional or integer number) can be used inplace of the mixer 472. The mixer 472 receives the LO signal derivedfrom the same source as Vref (described below) but at a differentfrequency. The mixer 472 downconverts the frequency of the signalreceived from the VCO 468 and provides it over connection 463 to oneinput terminal of the PFD 462. For example, the LO signal may be at 1giga-Hertz (GHz). The signal from the VCO 468 can be at 900 MHz, whichis downconverted by the mixer 472 to 100 MHz. Thus, the signal at thePFD 462 (on connection 463) from the mixer 472 is at 100 MHz. Inalternative embodiments, the controllable oscillator may besubstantially any type of oscillator and need not be voltage-controlled,and/or the PFD 462 can be substituted with a phase-detector or frequencydetector, as would be understood by one having ordinary skill in theart.

The PFD 462 receives a reference clock signal (Vref) at connection 461and a downconverted VCO output signal from the mixer 472 at connection463. The Vref signal can be derived from a crystal oscillator (notshown) that is a stand-alone device or integrated on the synthesizer 345(FIG. 3). The Vref signal, in one embodiment, can be controlled by thebaseband subsystem 320 (FIG. 3) via control connection 316 (FIG. 3). ThePFD 462 performs a frequency and phase comparison between the two inputsignals on connections 461 and 463, and provides a pulse-up signal atone of the nodes 465 or 467 disposed between the PFD 462 and the chargepump system 464. For example, a pulse-up signal can be provided at node465, and then provided to charge pump modules 469 a and 469 b.Similarly, a pulse-down signal can be provided to node 467, and thenprovided to charge pump modules 469 a and 469 b. The combination of thepulse-up signal and pulse-down signals from the PFD 462 provide anindication to each charge pump module 469 a and 469 b of the charge pumpsystem 464 whether to increase the frequency of its output controlsignals (e.g., current signal, I_(CP1) and current signal, I_(CP2)) orto decrease the frequency of its output control signals. The currentsignals I_(CP1) and I_(CP2) are thus a ratio of each other (i.e., thecurrent signals increase together or decrease together), and may vary inmagnitude (e.g., I_(CP2) can be ten times greater than I_(CP1)).

The charge pump modules 469 a and 469 b of the charge pump system 464convert the digital pulses received via nodes 465 and 467 to currentsignals, I_(CP1) and I_(CP2), which are provided to the loop filter 466via connections 480 and 482, respectively. In general, the loop filter466 has a dual path topology comprising an integrator path and alow-pass filter path. The summation of the integrator path and thelow-pass filter path is accomplished by using passive components. Theintegrator path, in one embodiment, comprises a resistor 494 and twoseries capacitors 492 and 490. Resistors 486 and 488 in parallel withcapacitor 484 comprise the LPF path. The summation of the two paths isdone by connecting resistor 488 to capacitor 490 at node 476. Thesummation is a weighted sum which is used to position (e.g., location inthe frequency domain) the zero in the frequency response of the loopfilter 466. As an example, the capacitance ratio of capacitor 492 overcapacitor 490 can be about 9. The resistance ratio of resistor 486 overresistor 488 can be about 6. The combined output is taken from node 477disposed between capacitor 492 and resistor 494, and then the signal isprovided through the high-frequency pole created by the resistor494-capacitor 496 arrangement. The resistor 494-capacitor 496arrangement attenuates the high-frequency signal components in the loopfilter 466. From node 471, the signal is provided to the VCO 468. Theextra pole created by resistor 494-capacitor 496 arrangement has anegligible effect on the frequency band of interest. In someembodiments, the resistor 494-capacitor 496 combination can be omitted,such as in implementations where there are no high-frequency signalcomponents and/or to simplify the loop filter circuitry.

Resistor 488 and capacitor 490 share node 475, which in one embodiment,is also connected to voltage source 473. The voltage source 473 canprovide a bias voltage at a voltage value selected from a range betweenthe supply voltage and ground, and is typically provided at a valuemidway between these two values. In some embodiments, the bias voltagecan be provided through a divider network, a bias generator, or othermechanisms. In some embodiments, the voltage source may be replaced witha connection to ground, although design considerations in suchimplementations may include addressing the voltage potential (e.g.,possibly zero) at connection 482 for steady-state conditions.

The circuitry of the loop filter 466 enables similar performancecharacteristics (e.g., frequency response) as the conventional and dualloop configurations shown in FIGS. 1 and 2, respectively, but with asubstantial reduction in the total capacitance of the phase-locked loop360 a when compared to the conventional phase-locked loop of FIG. 1.Additionally, no active devices are used to add the control signals ofthe integrator and LPF paths, thus reducing noise. Thus, thephase-locked loop 360 a uses passive components to do the summation ofthe integrator and LPF paths. The weighted summation can easily be doneby the ratio of the resistors 486 and 488 and capacitors 492 and 490, asdescribed above. The weighted summation can be represented by a transferfunction of the loop filter 466 determined through, among othertechniques, computer-aided design tools.

Additionally, the VCO 468 of the phase-locked loop 360 a includes onlyone set of varactors (not shown). This reduction in the number ofvaractor sets is made possible by a loop filter configuration thatperforms the summation in the loop filter 466. Thus, the loop filter 466receives two current signals from the charge pump system 464, andprovides a single output to the VCO 468 (e.g., provided to one varactorset of the VCO 468). Thus, only one set of back-to-back varactors isneeded. There is no need to have two sets of weighted back-to-backvaractors to perform summation of signals on the dual paths, such as onefor the integrator path and the other for the LPF path as used inconventional systems.

Note that other embodiments of the phase-locked loop 360 (FIG. 3) arecontemplated, such as embodiments that omit the charge pump system 464and replace the PFD 462 with a phase or frequency detector. For example,in embodiments that omit the charge pump system 464, voltage controlsignals can be output from a detector that could be filtered with a loopfilter of like-configuration to loop filter 466 but configured for avoltage signal input versus a current signal input.

FIG. 5 is a block diagram illustrating another embodiment of thephase-locked loop 360 (FIG. 3). The phase-locked loop 360 b includeslike components to those described in the phase-locked loop 360 a ofFIG. 4, including the phase-frequency detector (PFD) 462, the chargepump system 464 having charge pump modules 469 a and 469 b, thevoltage-controlled oscillator (VCO) 468, and further including adivide-by-N (/N) module 470, where N can be a fractional or integervalue. In some embodiments, the divide-by-N module 470 can be replacedwith a mixer as explained above. Similar to the phase-locked loop 360 aof FIG. 4, the charge pump (CP) module 469 b is in parallel with andpreferably produces a larger current output value in current signalI_(CP2) (e.g., ten times larger) than the current signal I_(CP1)produced by charge pump (CP) module 469 a. The current signals I_(CP1)and I_(CP2) have current values that are a ratio of each other. The loopfilter 566 includes parallel capacitors 571 and 575, and a resistor 573in series with capacitor 571. The output signal (e.g., current signal,I_(CP2)) of charge pump module 469 b provided on connection 582 isprovided to the resistor 573, which acts as a zero resistor.

The passive components of the loop filter 566 can be integrated on-chipby increasing the current across the resistor 573 and scaling back thecurrent through the capacitors 571 and 575. By increasing the currentthrough the resistor 573 as opposed to just increasing the resistancevalue, thermal noise can be reduced. Thus, the phase-locked loop 360 bprovides for a low-frequency zero by increasing the voltage across theresistor 573 using current signal I_(CP2), while scaling back thecurrent through capacitors 571 and 575. The effect of providing theoutput signal (e.g., I_(CP2)) of the charge pump module 469 b to theresistor 573 is an amplification of the voltage across the resistor 573,which effectively amplifies the zero location. In other words, a largervoltage is created across the resistor 573 by increasing the current,I_(CP2), driven across resistor 573 (as opposed to increasing theresistance of resistor 573, which can create thermal noise). The twopaths for the current signals I_(CP1) and I_(CP2) are combined usingpassive components, unlike prior-art methods that combine paths in avoltage controlled oscillator or combine paths using active circuitry.

Although not shown, the loop filter 566 may be configured with circuitrydisposed between capacitor 575 and the VCO 468 to create ahigh-frequency pole (e.g., similar to the resistor 494-capacitor 496arrangement shown in FIG. 4).

Note that resistor 573 is disposed between node 574 and a voltage source473. As explained above in association with FIG. 4, the bias voltageprovided by the voltage source 473 can be provided by other mechanisms,and/or replaced with electrical ground in some embodiments.

While various embodiments of the phase-locked loop 360 (FIG. 3) havebeen described, it will be apparent to those of ordinary skill in theart that many more embodiments and implementations are possible that arewithin the scope of the disclosed phase-locked loop 360 andcorresponding methods.

1. A semi-conductor chip, comprising: a phase-locked loop including: acharge pump system comprising a first charge pump and a second chargepump configured to provide control signals comprising a first controlsignal and a second control signal, respectively, wherein the firstcontrol signal increases or decreases in magnitude concurrently with thesecond control signal; a dual path filter, the dual path filterconsisting of passive components that are configured in a defined ratioto provide summation of the control signals, wherein the dual pathfilter includes a first node coupled between the first charge pump and afirst capacitor, wherein the dual oath filter includes a second nodecoupled to the second charge pump through a first resistor, wherein thesecond node is connected to the first capacitor; and a voltage sourcecoupled to the second node through a second resistor.
 2. The chip ofclaim 1, wherein the dual path filter includes an integrator coupled toa low-pass filter.
 3. The chip of claim 1, wherein the dual path filteris integrated with the phase-locked loop on the chip.
 4. The chip ofclaim 1, wherein the passive components are configured to provide atleast one of a low-frequency zero and a high-frequency pole.
 5. Aphase-locked loop, comprising: a charge pump system comprising a firstcharge pump and a second charge pump, the charge pump system configuredto provide control signals; a dual path filter, the dual path filterconsisting of passive components that are configured to providesummation of the control signals, wherein the dual path filter includesa first node coupled between a first charge pump and a first capacitor,wherein the dual path filter includes a second node coupled to a secondcharge pump through a first resistor, wherein the second node isconnected to the first capacitor; and a voltage source coupled to thesecond node through a second resistor.
 6. The phase-locked loop of claim5, further including a third node coupled between the voltage source andthe second resistor.
 7. The phase-locked loop of claim 6, furtherincluding a second capacitor coupled between the first capacitor and thethird node.
 8. The phase-locked loop of claim 7, further including athird capacitor coupled between ground and the first resistor.
 9. Thephase-locked loop of claim 5, further including an oscillator coupled toa single output connection corresponding to the loop filter, the singleoutput connection configured to carry the summed control signals. 10.The phase-locked loop of claim 5, further including a phrase-frequencydetector coupled to the charge pump system.
 11. The phase-locked loop ofclaim 5, further including a divide-by-N module receptive to an outputsignal from the oscillator, wherein N is a fractional number or aninteger number.
 12. The phase-locked loop of claim 5, further includinga mixer receptive to an output signal from the oscillator.
 13. Atransceiver, comprising: a phase-locked loop, comprising: a charge pumpsystem comprising a first charge pump and a second charge pump, thecharge pump system configured to provide control signals; a dual pathfilter, the dual path filter consisting of passive components that areconfigured to provide summation of the control signals, wherein the dualpath filter includes a first node coupled between a first charge pumpand a first capacitor, wherein the dual path filter includes a secondnode coupled to a second charge pump through a first resistor, whereinthe second node is connected to the first capacitor; and a voltagesource coupled to the second node through a second resistor.
 14. Thetransceiver of claim 13, further including a third node coupled betweenthe voltage source and the second resistor.
 15. The transceiver of claim14, further including a second capacitor coupled between the firstcapacitor and the third node.
 16. The transceiver of claim 15, furtherincluding a third capacitor coupled between ground and the firstresistor.
 17. The transceiver of claim 13, further including anoscillator coupled to a single output connection corresponding to theloop filter, the single output connection configured to carry the summedcontrol signals.
 18. The transceiver of claim 13, further including aphrase-frequency detector coupled to the charge pump system.
 19. Thetransceiver of claim 13, further including a divide-by-N modulereceptive to an output signal from the oscillator, wherein N is afractional number or an integer number.
 20. The transceiver of claim 13,further including a mixer receptive to an output signal from theoscillator.